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1ST280EY3F50I3VLS1中文資料英特爾數(shù)據(jù)手冊PDF規(guī)格書

1ST280EY3F50I3VLS1
廠商型號

1ST280EY3F50I3VLS1

功能描述

Intel? Stratix? 10 TX Device Overview

文件大小

341.12 Kbytes

頁面數(shù)量

39

生產(chǎn)廠商 Intel Corporation
企業(yè)簡稱

Intel英特爾

中文名稱

英特爾官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-2-19 14:15:00

1ST280EY3F50I3VLS1規(guī)格書詳情

Intel? Stratix? 10 TX FPGAs feature power-efficient, dual-mode transceivers, capable

of both 57.8 Gbps PAM4 (Pulse Amplitude Modulation) and 28.9 Gbps NRZ (Non

Return to Zero) operation. Supported by hardened PCI Express Gen 3 and 10/25/100

Gbps Ethernet MAC IP blocks, these devices can deliver over 8 Tbps of aggregate

bandwidth, meeting the demanding transceiver bandwidth and power budget

specifications of next generation designs.

In addition to the 57.8 Gbps PAM4 / 28.9 Gbps NRZ dual-mode transceivers, Intel

Stratix 10 TX devices feature several other breakthrough innovations. These include

all new HyperFlex? core architecture, hardened floating point DSP blocks, hardened

external memory controllers and advanced packaging technology based on Intel's

Embedded Multi-die Interconnect Bridge (EMIB).

With an embedded quad-core 64-bit Arm* Cortex*-A53 hard processor system (HPS)

available in select devices, Intel Stratix 10 TX FPGAs deliver power efficient,

application-class processing, and allow designers to extend hardware virtualization

into the FPGA fabric.

Intel Stratix 10 TX FPGAs integrate a monolithic 14 nm FPGA fabric die with multiple

high-speed transceiver tiles, all inside a single flip-chip BGA package. This

implementation, combined with the unmatched transceiver bandwidth and core fabric

performance, demonstrates Intel's commitment to deliver high-performance

programmable solutions to your most challenging system design problems.

Important innovations in Intel Stratix 10 TX devices include:

? All new Intel Hyperflex? core architecture delivering 2X the core performance

compared to previous generation high-performance FPGAs

? Intel 14 nm tri-gate (FinFET) technology

? Heterogeneous 3D System-in-Package (SiP) technology

? Monolithic core fabric with up to 2.8 million logic elements (LEs)

? Up to 144 full duplex transceiver channels on heterogeneous 3D SiP transceiver tiles

? Transceiver data rates up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip-to-chip,

chip-to-module, and backplane applications

? Embedded eSRAM (47.25 Mbit) in select devices, and M20K (20 Kb) internal SRAM

memory blocks

? Fractional synthesis and ultra-low jitter LC tank based transmit phase locked loops

(PLLs)

? Hard PCI Express? Gen3 x16 intellectual property (IP) blocks

? Hard 10/25/100 Gbps Ethernet MAC with dedicated Reed-Solomon FEC for NRZ

signals (528, 514) and PAM4 signals (544, 514)

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價格
INTEL
22+
N/A
820
原裝原裝原裝
詢價
TOSHIBA
0712+
TO92S
9842
一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力
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AGILENT
24+
BGA
5642
公司原廠原裝現(xiàn)貨假一罰十!特價出售!強(qiáng)勢庫存!
詢價
INTEL/英特爾
23+
2912-BBGAFCBGA
1930
只做原裝,主打品牌QQ詢價有詢必回
詢價
TOSHIBA
2020+
TO-92S
12856
百分百原裝正品 真實(shí)公司現(xiàn)貨庫存 本公司只做原裝 可
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TOSHIBA
TO-92
608900
原包原標(biāo)簽100%進(jìn)口原裝常備現(xiàn)貨!
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HP
99
8
公司優(yōu)勢庫存 熱賣中!!
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AGILENT
24+
BGA
6540
原裝現(xiàn)貨/歡迎來電咨詢
詢價
N/A
2023+
NA
80000
一級代理/分銷渠道價格優(yōu)勢 十年芯程一路只做原裝正品
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AGILENT
23+
BGA金底
38
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