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BPF-A355+

BandpassFilter

MINI

Mini-Circuits

BUZ355

SIPMOSPowerTransistor(NchannelEnhancementmodeAvalanche-rated)

SIPMOS?PowerTransistor ?Nchannel ?Enhancementmode ?Avalanche-rated

SIEMENSSiemens Semiconductor Group

西門子德國(guó)西門子股份公司

BUZ355

Enhancementmode

Nchannel Enhancementmode Avalanche-rated

NJSEMINew Jersey Semi-Conductor Products, Inc.

新澤西半導(dǎo)體新澤西半導(dǎo)體產(chǎn)品股份有限公司

BUZ355

iscN-ChannelMOSFETTransistor

FEATURES ·DrainCurrent:ID=6.0A@TC=25℃ ·DrainSourceVoltage :VDSS=800V(Min) ·StaticDrain-SourceOn-Resistance :RDS(on)=1.5Ω(Max)@VGS=10V ·100avalanchetested ·MinimumLot-to-Lotvariationsforrobustdevice performanceandreliableoperation DESCRIPTION ·motordrive,

ISCInchange Semiconductor Company Limited

無(wú)錫固電無(wú)錫固電半導(dǎo)體股份有限公司

CASD355SG

100V/100mASURFACEMOUNTSWITCHINGDIODE

CYSTEKECCystech Electonics Corp.

全宇昕科技全宇昕科技股份有限公司

CASD355SY

80V/100mASURFACEMOUNTSWITCHINGDIODE

CYSTEKECCystech Electonics Corp.

全宇昕科技全宇昕科技股份有限公司

CDSF355

SMDSwitchingDiode

HighSpeed Features Designedformountingonsmallsurface. Highspeedswitching. Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,m

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDSF355B

SMDSwitchingDiode

HighSpeed Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent. Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Gol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDSF355B-HF

SMDSwitchingDiode

HighSpeed Features Halogenfree. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent. Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDSF355BS-HF

SMDSwitchingDiode

RoHSDevice HalogenFree Features -HighSpeed. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent. -Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplas

COMCHIPComchip Technology

典琦典琦科技股份有限公司

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BUSSMANN巴斯曼熔斷器
2022+
大圓柱Fuse
1750
長(zhǎng)期供應(yīng),價(jià)格優(yōu)勢(shì),全新原裝,支持實(shí)單,
 詢價(jià)
BUSSMANN/巴斯曼
23+
標(biāo)準(zhǔn)封裝
5000
原廠授權(quán)一級(jí)代理 IGBT模塊 可控硅 晶閘管 熔斷器質(zhì)保
 詢價(jià)
BUSSMANN/巴斯曼
2023+
module
48000
AI智能識(shí)別、工業(yè)、汽車、醫(yī)療方案LPC批量及配套一站
 詢價(jià)
BUSSMANN
23+
MODULE
1000
全新原裝現(xiàn)貨
 詢價(jià)
Illinois
1931+
N/A
18
加我qq或微信，了解更多詳細(xì)信息,體驗(yàn)一站式購(gòu)物
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Illinois
22+
NA
18
加我QQ或微信咨詢更多詳細(xì)信息,
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BUSSMAN
專業(yè)模塊
MODULE
8513
模塊原裝主營(yíng)-可開(kāi)原型號(hào)增稅票
 詢價(jià)
BUSSMANN/巴斯曼
23+
MODULE
5000
原廠授權(quán)代理,海外優(yōu)勢(shì)訂貨渠道?？商峁┐罅繋?kù)存,詳
 詢價(jià)
24+
N/A
69000
一級(jí)代理-主營(yíng)優(yōu)勢(shì)-實(shí)惠價(jià)格-不悔選擇
 詢價(jià)
BUSSMAN
24+
MODULE
2100
公司大量全新現(xiàn)貨 隨時(shí)可以發(fā)貨
 詢價(jià)
更多355LMT供應(yīng)商 更新時(shí)間2025-4-7 15:00:00

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