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6381BG

Channel style heat sink with folded back fins

Channelstyleheatsinkwithfoldedbackfinsforincreasedcoolingsurfacearea.Availablewithtinplatedsolderabletabsforeasyattachmenttotheprintedcircuitcard.

AAVID

Aavid, Thermal Division of Boyd Corporation

6381BG

How to Use This Catalog

AAVID

Aavid, Thermal Division of Boyd Corporation

6381BG

包裝:盒 類別:風(fēng)扇,熱管理 熱敏 - 散熱器 描述:BOARD LEVEL HEAT SINK

AAVID

Aavid, Thermal Division of Boyd Corporation

BB6381KU

ControlICforCD-R/RWdrive

ROHMRohm

羅姆羅姆半導(dǎo)體集團(tuán)

BD6381EFV

LowVoltageSteppingMotorDrivers

ROHMRohm

羅姆羅姆半導(dǎo)體集團(tuán)

BD6381EFV

Siliconmonolithicintegratedcircuits

ROHMRohm

羅姆羅姆半導(dǎo)體集團(tuán)

BD6381EFV

Bipolarsteppingmotordriver

ROHMRohm

羅姆羅姆半導(dǎo)體集團(tuán)

DM6381F

V.34IntegratedData/Fax/Voice/SpeakerphoneModemDeviceSet

[Davicom] GeneralDescription TheDM336Pintegratedmodemisafourchipsetdesignthatprovidesacompletesolutionforstate-ofthe-art,voice-bandPlainOldTelephoneService(POTS)communication.ThemodemprovidesforData(upto33,600bps),Fax(upto14,400bps),VoiceandFullDuple

ETCList of Unclassifed Manufacturers

未分類制造商

EPE6381

10Base-TInterfaceModulewithEnhancedCommonModeAttenuation

10Base-TInterfaceModulewithEnhancedCommonModeAttenuation ?GeneralPurpose10Base-TFilterModule ?ComplieswithorexceedsIEEE802.3,10Base-TStandards

PCA

PCA ELECTRONICS INC.

ISL6381

EAPPHybridDigital4-PhaseGreenPWMControllerforDigitalPowerManagementofCoreandMemoryWithAUTOPhaseShedding

TheISL6381isanEAPPHybridDigital4-PhasePWMcontroller andisdesignedtobecomplianttoIntelVR12.5/VR12 specificationsandcontrolthemicroprocessorcoreormemory voltageregulator.Itincludesprogrammablefunctionsand telemetriesforeasyuse,highsystemflexibilityand overcl

Intersil

Intersil Corporation

產(chǎn)品屬性

  • 產(chǎn)品編號(hào):

    6381BG

  • 制造商:

    Aavid, Thermal Division of Boyd Corporation

  • 類別:

    風(fēng)扇,熱管理 > 熱敏 - 散熱器

  • 包裝:

  • 類型:

    插件板級(jí),垂直

  • 冷卻的封裝:

    TO-220,TO-218

  • 連接方法:

    螺栓固定和 PC 引腳

  • 形狀:

    矩形,鰭片

  • 長(zhǎng)度:

    1.500"(38.10mm)

  • 寬度:

    1.650"(41.91mm)

  • 鰭片高度:

    1.000"(25.40mm)

  • 不同溫升時(shí)功率耗散:

    6.0W @ 50°C

  • 不同強(qiáng)制氣流時(shí)熱阻:

    3.50°C/W @ 200 LFM

  • 自然條件下熱阻:

    5.80°C/W

  • 材料:

  • 材料表面處理:

    黑色陽(yáng)極化處理

  • 描述:

    BOARD LEVEL HEAT SINK

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
24+
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82000
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6878
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TSSOP8
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SOP-8
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MOLEX/莫仕
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TE Connectivity
2021+
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285000
專供連接器,軍工合格供應(yīng)商!
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TE
20+
連接器
2963
就找我吧!--邀您體驗(yàn)愉快問購(gòu)元件!
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更多6381BG供應(yīng)商 更新時(shí)間2025-4-6 9:06:00