935146528247-F2T中文資料村田數(shù)據(jù)手冊PDF規(guī)格書

? Compatible with MLCC footprint

? Ultra-high stability of capacitance value:

o Temperature 70ppm/K (-55 °C to +150 °C)

o Voltage <0.02/Volt

o Negligible capacitance loss through ageing

? Low profile 0.1mm

? Small size 0.5 x 0.25 mm (0201 format)? Break down voltage : 150V

? Low leakage current

? High reliability

? High operating temperature (up to 150 °C)

? Compatible with high temperature cycling

during manufacturing operations (exceeding 300 °C)

? Compatible with EIA 0201 footprint

? Applicable for standard wire bonding assembly (ball and wedge)