A220-200B50P-0215中文資料ETC數(shù)據(jù)手冊PDF規(guī)格書

Features

? One-half the volume and mass of traditional

process carriers

? One-fourth the surface area of traditional process

carriers

? Modular construction includes reinforcement

rods for added rigidity and strength

? Lift points on carrier ends for automated

handling

? V-notch locators on carrier ends and rails for

location on equipment

? Wafer capacity: 50

? Pocket spacing: 6.4 mm (0.25)

Traditional Process

Wafer Carriers

Features

? Low and high profile

? “H” bar for equipment interface

? Locating track notches at the center of the

thirteenth pocket

? Pins and holes on the top rail (unless noted)

? Wafer capacity: 25, 26 or 50

? D1 dimension: 25.4 mm (1.00)

? Pocket spacing: A192-82M: 3.2 mm (0.13)

All others: 6.4 mm (0.25)

? Pocket flat: 1.7 mm (0.07)