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A3P600-FG256集成電路（IC）的FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列）規(guī)格書(shū)PDF中文資料
| 廠(chǎng)商型號(hào) |
A3P600-FG256 |
| 參數(shù)屬性 | A3P600-FG256 封裝/外殼為256-LBGA；包裝為托盤(pán)；類(lèi)別為集成電路（IC）的FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列）；產(chǎn)品描述：IC FPGA 177 I/O 256FBGA |
| 功能描述 | ProASIC3 Flash Family FPGAs with Optional Soft ARM Support |
| 封裝外殼 | 256-LBGA |
| 文件大小 |
9.57546 Mbytes |
| 頁(yè)面數(shù)量 |
210 頁(yè) |
| 生產(chǎn)廠(chǎng)商 | Microsemi Corporation |
| 企業(yè)簡(jiǎn)稱(chēng) |
Microsemi【美高森美】 |
| 中文名稱(chēng) | 美高森美公司官網(wǎng) |
| 原廠(chǎng)標(biāo)識(shí) |  |
| 數(shù)據(jù)手冊(cè) | |
| 更新時(shí)間 | 2025-2-22 9:30:00 |
| 人工找貨 | A3P600-FG256價(jià)格和庫(kù)存，歡迎聯(lián)系客服免費(fèi)人工找貨 |
A3P600-FG256規(guī)格書(shū)詳情
Features and Benefits
High Capacity
? 15 k to 1 M System Gates
? Up to 144 kbits of True Dual-Port SRAM
? Up to 300 User I/Os
Reprogrammable Flash Technology
? 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
? Instant On Level 0 Support
? Single-Chip Solution
? Retains Programmed Design when Powered Off
High Performance
? 350 MHz System Performance
? 3.3 V, 66 MHz 64-Bit PCI?
In-System Programming (ISP) and Security
? ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM?-enabled ProASIC?3 devices) via JTAG (IEEE 1532–compliant)?
? FlashLock? to Secure FPGA Contents
Low Power
? Core Voltage for Low Power
? Support for 1.5 V-Only Systems
? Low-Impedance Flash Switches
High-Performance Routing Hierarchy
? Segmented, Hierarchical Routing and Clock Structure
Advanced I/O
? 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
? 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
? Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V
? Bank-Selectable I/O Voltages—up to 4 Banks per Chip
? Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X? and LVCMOS 2.5 V / 5.0 V Input
? Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and above)
? I/O Registers on Input, Output, and Enable Paths
? Hot-Swappable and Cold Sparing I/Os?
? Programmable Output Slew Rate? and Drive Strength
? Weak Pull-Up/-Down
? IEEE 1149.1 (JTAG) Boundary Scan Test
? Pin-Compatible Packages across the ProASIC3 Family
Clock Conditioning Circuit (CCC) and PLL?
? Six CCC Blocks, One with an Integrated PLL
? Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback
? Wide Input Frequency Range (1.5 MHz to 350 MHz)
Embedded Memory?
? 1 kbit of FlashROM User Nonvolatile Memory
? SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)?
? True Dual-Port SRAM (except ×18)
ARM Processor Support in ProASIC3 FPGAs
? M1 ProASIC3 Devices—ARM?Cortex?-M1 Soft Processor Available with or without Debug
產(chǎn)品屬性
- 產(chǎn)品編號(hào)：
A3P600-FG256
- 制造商：
Microchip Technology
- 類(lèi)別：
集成電路（IC） > FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列）
- 系列：
ProASIC3
- 包裝：
托盤(pán)
- 電壓 - 供電：
1.425V ~ 1.575V
- 安裝類(lèi)型：
表面貼裝型
- 工作溫度：
0°C ~ 85°C（TJ）
- 封裝/外殼：
256-LBGA
- 供應(yīng)商器件封裝：
256-FPBGA（17x17）
- 描述：
IC FPGA 177 I/O 256FBGA
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
Microchip |
21+ |
Low Profile Fine Pitch Ball Gr |
15000 |
只做原裝 |
詢(xún)價(jià) | ||
Microchip/Microsemi |
24+ |
FBGA |
2682 |
全新原廠(chǎng)原裝，進(jìn)口正品現(xiàn)貨，正規(guī)渠道可含稅??！ |
詢(xún)價(jià) | ||
Microsemi(美高森美) |
23+ |
FPBGA-256 |
970 |
深耕行業(yè)12年,可提供技術(shù)支持。 |
詢(xún)價(jià) | ||
ACTEL/愛(ài)特 |
22+ |
FBGA-256 |
9000 |
原裝正品 |
詢(xún)價(jià) | ||
MICROSE |
2020+ |
FBGA-25 |
80000 |
只做自己庫(kù)存,全新原裝進(jìn)口正品假一賠百,可開(kāi)13%增 |
詢(xún)價(jià) | ||
Microsemi SoC |
23+ |
256-LBGA |
11200 |
主營(yíng):汽車(chē)電子,停產(chǎn)物料,軍工IC |
詢(xún)價(jià) | ||
MICROSEMI |
638 |
原裝正品 |
詢(xún)價(jià) | ||||
Microsemi Corporation |
24+ |
256-FPBGA(17x17) |
65200 |
一級(jí)代理/放心采購(gòu) |
詢(xún)價(jià) | ||
MICROSEMI |
23+ |
FBGA-256 |
10000 |
原裝正品現(xiàn)貨 |
詢(xún)價(jià) | ||
MICROSEMI |
23+ |
FBGA-256 |
9 |
全新原裝正品現(xiàn)貨,支持訂貨 |
詢(xún)價(jià) |
