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AG603-89PCB中文資料ETC數(shù)據(jù)手冊(cè)PDF規(guī)格書

AG603-89PCB
廠商型號(hào)

AG603-89PCB

功能描述

InGaP HBT Gain Block

文件大小

167.48 Kbytes

頁(yè)面數(shù)量

2 頁(yè)

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企業(yè)簡(jiǎn)稱

ETC

中文名稱

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原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

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更新時(shí)間

2025-2-21 15:05:00

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AG603-89PCB規(guī)格書詳情

[WJ]

Product Description

The AG603 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 900 MHz, the AG603 typically provides 17.6 dB of gain, +33.5 dBm Output IP3, and +18.5 dBm P1dB. The device combines dependable performance with consistent quality to maintain MTBF values exceeding 100 years at mounting temperatures of +85°C and is housed in a SOT-89 industry standard SMT package.

The AG603 consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT technology process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation.

The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, W-CDMA, and UMTS. In addition, the AG603 will work for other various applications within the DC to 2.7 GHz frequency range such as CATV and fixed wireless.

Product Features

? DC - 2700MHz

? +18.5 dBm P1dB at 900MHz

? +33.5 dBm OIP3 at 900MHz

? 17.6 dB Gain at 900MHz

? Single Voltage Supply

? SOT-89 SMT Package

? Internally matched to 50 ?

產(chǎn)品屬性

  • 型號(hào):

    AG603-89PCB

  • 功能描述:

    射頻開發(fā)工具 700-2400MHz Eval Brd 19.5dBm 18.5dB Gain

  • RoHS:

  • 制造商:

    Taiyo Yuden

  • 產(chǎn)品:

    Wireless Modules

  • 類型:

    Wireless Audio

  • 工具用于評(píng)估:

    WYSAAVDX7

  • 工作電源電壓:

    3.4 V to 5.5 V

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