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AM261X中文資料德州儀器數(shù)據(jù)手冊PDF規(guī)格書

AM261X
廠商型號

AM261X

功能描述

AM261x Sitara? Microcontrollers

文件大小

4.76483 Mbytes

頁面數(shù)量

101

生產(chǎn)廠商 Texas Instruments
企業(yè)簡稱

TI德州儀器

中文名稱

美國德州儀器公司官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

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更新時間

2025-2-7 10:36:00

AM261X規(guī)格書詳情

1 Features

Processor Cores:

? Single and Dual Arm? Cortex? R5F CPU with each

core running up to 500 MHz

– 16KB I-Cache with 64-bit ECC per CPU core

– 16KB D-cache with 32-bit ECC per CPU core

– 256KB Tightly Coupled Memory (TCM) per

core, with 32-bit ECC

– Lockstep or Dual core operation supported

? Trigonometric Math Unit (TMU) for accelerating

trigonometric functions

– Up to 2 × TMU, one per R5F MCU core

Memory Subsystem:

? 1.5MB of On-Chip Shared SRAM (3 banks ×

512KB). ECC error protection for full 1.5MB

OCSRAM.

? 256KB Remote Low latency L2 cache (RL2),

software programmable, shared between all cores,

allocated from SRAM

System on Chip (SoC) Services and Architecture:

? 1 × EDMA to support data movement functions

? Device Boot supported from the following

interfaces:

– UART (Primary/Backup)

– OSPI NOR and NAND Flash (50MHz SDR and

25MHz DDR)

– USB Peripheral boot

? Interprocessor communication modules

– SPINLOCK module for synchronizing

processes running on multiple R5F CPUs and

HSM CPU

– MAILBOX functionality implemented through

CTRLMMR registers

Flash Memory Interfaces:

? 2 × Octal Serial Peripheral Interface (OSPI) at up

to 133-MHz SDR and 133-MHz DDR at 1.8V and

3.3V which can be used for

– External flash memory with full XIP (eXecute In

Place) support

– RAM expansion/FOTA

? 1 × 4-bit Multi-Media Card/Secure Digital

(MMC/SD) interface

? General-Purpose Memory Controller (GPMC)

– 16-bit parallel data bus with 22-bit address bus

and 4 chip selects

– Up to 4MB addressable memory space

– Integrated Error Location Module (ELM)

support for error checking

General Connectivity:

? 6 × Universal Asynchronous RX-TX (UART)

modules

? 4 × Serial Peripheral Interface (SPI) controllers

? 3 × Local Interconnect Network (LIN) ports

? 3 × Inter-Integrated Circuit (I2C) ports

? 2 × Modular Controller Area Network (MCAN)

modules with CAN-FD support

? 1 × Fast Serial Interface Transmitter (FSITX) at up

to 200Mbps

? 1 × Fast Serial Interface Receiver (FSIRX) at up to

200Mbps

? Up to 140 × General Purpose I/O (GPIO)

USB 2.0

? Port configurable as USB host, USB device, or

USB Dual-Role device

? USB 2.0 Host mode

– High-Speed (HS, 480Mbps)

– Full-Speed (FS, 12Mbps)

– Low-Speed (LS, 1.5Mbps)

? USB 2.0 Device mode

– High-Speed (HS, 480Mbps)

– Full-Speed (FS, 12Mbps)

Sensing and Actuation:

? Real-time Control Subsystem (CONTROLSS)

? Flexible Input/Output Crossbars (XBAR)

? 3 × 12-bit Analog to Digital Converters (ADC) with

3 MSPS maximum sampling rate

– Each ADC module with

? 7× Single ended channels OR

? 3 × Differential channels

– Highly configurable ADC digital logic

? With selectable internal or external

reference

? 4 × Post-Processing blocks for each ADC

module

? 9 × Analog Comparators with internal 12-bit DAC

reference (CMPSS-A)

? 1 × 12 bit Digital to Analog Converter (DAC)

? 10 × Enhanced High Resolution Pulse Width

Modulation (eHRPWM) modules

– Single or Dual PWM channels

– Advanced PWM Configurations

– Enhanced HRPWM extends the time resolution

of the PWM compared to EPWM

? 8 × Enhanced Capture (ECAP) modules

? 2 × Enhanced Quadrature Encoder Pulse (EQEP)

modules

? 2 × Sigma-Delta Filter Modules (SDFM)

Industrial Connectivity:

? 2× Programmable Real-time Unit – Industrial

Communication SubSystem(2× PRU-ICSS)

– 2× PRU per ICSS for a total of 4 PRU cores

– Dual core Programmable Realtime Unit

Subsystem (PRU0 / PRU1)

? Deterministic hardware

? Dynamic firmware

– 20-channel enhanced input (eGPI) per PRU

– 20-channel enhanced output (eGPO) per PRU

– Embedded Peripherals and Memory

? 1 × UART, 1x ECAP

? 1 × MDIO, 1x IEP

? 1 × 32KB Shared General Purpose RAM

? 2 × 8KB Shared Data RAM

? 1 × 12KB IRAM per PRU

? ScratchPad (SPAD), MAC/CRC

– Digital encoder and sigma-delta control loops

– The PRU-ICSS enables advanced industrial

protocols including:

? EtherCAT?, Ethernet/IP?

? PROFINET?, IO-Link?

– Dedicated Interrupt Controller (INTC)

– Dynamic CONTROLSS XBAR Integration

– Supports standard ethernet (EMAC) – up to 2

external ports

High Speed Interfaces

? Integrated Ethernet Switch(CPSW3G)

– Supporting two external ports and one internal

port with selectable MII/ RMII/ RGMII

– IEEE 1588 (2008 Annex D, Annex E, Annex F)

with 802.1AS PTP

– Clause 45 MDIO PHY management

– 512 × ALE engine based packet classifiers

– Priority flow control with up to 2KB packet size

– Four CPU hardware interrupt pacing

– IP/ UDP/ TCP checksum offload in hardware

– Supports TSN

Security:

? Hardware Security Module (HSM) with support for

Auto SHE 1.1/EVITA

? Targeted for ISO 21434 compliance

? Secure boot support

– Device Take Over Protection

– Hardware enforced root-of-trust

– Authenticated boot

– SW Anti-rollback protection

? Debug security

– Secure device debug only after proper

authentication

– Ability to disable device debug functionality

? Device ID and Key Management

– Support for OTP Memory (FUSEROM)

? Store root keys and other security fields

– Separate EFUSE controllers and FUSE ROMs

– Unique Device Public Identifiers

? Memory Protection Units (MPU)

– Dedicated Arm? MPU per Cortex?-R5F core

– System MPU - present at various interfaces in

the SoC (MPU or Firewall)

– 8 to 16 Programmable Regions

? Enable/Privilege ID

? Start/End Address

? Read/Write/Cachable

? Secure/Non-Secure

? Cryptographic acceleration

– Cryptographic cores with DMA Support

– AES - 128/192/256-bit key sizes

– SHA2 - 256/384/512-bit support

– DRBG with pseudo and true random number

generator

Functional Safety:

? Enables design of systems with functional safety

requirements

– Error Signaling Module (ESM)

– ECC or parity on calculation critical memories

– Built-In Self-Test (BIST) on-chip RAM

– Runtime internal diagnostic modules including

voltage, temperature, and clock monitoring,

windowed watchdog timers, CRC engines for

memory integrity checks

? Functional Safety-Compliant targeted [Industrial]

– Developed for functional safety applications

– Documentation to be made available to aid IEC

61508 functional safety system design

– Systematic capability up to SIL-3 targeted

– Hardware integrity up to SIL-3 targeted

– Safety-related certification

? IEC 61508 planned

? Functional Safety-Compliant targeted [Automotive]

– Developed for functional safety applications

– Documentation to be made available to aid ISO

26262 functional safety system design

– Systematic capability up to ASIL-D targeted

– Hardware integrity up to ASIL-D targeted

– Safety-related certification

? ISO 26262 planned

Technology / Package:

? AEC-Q100 qualified for automotive applications

? Package options

– Available multiple NFBGA packages (see

Section 3)

– With 0.5mm, 0.65 mm and 0.8 mm pitch

options

2 Applications

? General Purpose Safety MCU

? Two axis servo drive

? AC Inverter

? Industrial Digital Power Control

– Energy storage systems

– EV charging

– String Inverters

? Remote I/O

? Communication Module

? Automotive Digital Power Conversion/Control

– On-board Chargers, DC/DC Converters

– Battery Management Systems (BMS)

? Telematics Control Unit

3 Description

The AM261x Sitara Arm? Microcontrollers are part of Sitara AM26x real-time MCU families designed to meet

the complex real-time processing needs of next generation industrial and automotive embedded products. With

scalable Arm Cortex? R5F performance and an extensive set of peripherals, AM261x device is designed for a

broad range of applications while offering safety features and optimized peripherals for real time control.

Key features and benefits:

? Peripherals supporting system level connectivity such as Gigabit Ethernet, USB, OSPI/QSPI, CAN, UARTs,

SPI and GPIOs.

? Granular firewalls managed by Hardware Security Manager (HSM) enable developers to implement stringent

security minded system design requirements.

? Up to two R5F cores in cluster with 256KB of shared Tightly Coupled Memory (TCM) per core along with

1.5MB of shared SRAM, greatly reducing the need for external memory.

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