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BES0330

Inductive Sensors

BalluffBalluff Korea Ltd.

巴魯夫巴魯夫集團(tuán)

CDBF0330

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gold

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0330-HF

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0330

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0330-HF

SMDSchottkyBarrierDiode

Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU0330

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Gol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU0330-HF

SMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU0330-HF

SMDSchottkyBarrierDiode

Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Gol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBUR0330

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Gold

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBUR0330-HF

SMDSchottkyBarrierDiode

Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Gol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

供應(yīng)商型號品牌批號封裝庫存備注價(jià)格
24+
N/A
80000
一級代理-主營優(yōu)勢-實(shí)惠價(jià)格-不悔選擇
 詢價(jià)
BALLUFF
24+
con
2000
優(yōu)勢庫存,原裝正品
 詢價(jià)
BORN
22+
DFN2×2-3L
25000
伯恩全系列在售
 詢價(jià)
BORN
22+
DFN2×2-3L
20000
原裝正品假一罰十,代理渠道價(jià)格優(yōu)
 詢價(jià)
SXSEMI
24+
DFN2020
900000
原裝進(jìn)口特價(jià)
 詢價(jià)
APPLIED MATERIALS (AMAT)
NDC
80
公司優(yōu)勢庫存 熱賣中!
 詢價(jià)
24+
36000
詢價(jià)
CHINAXYJ
23+
1608
9868
專做原裝正品,假一罰百!
 詢價(jià)
BES
23+
BGA
15000
全新原裝現(xiàn)貨,價(jià)格優(yōu)勢
 詢價(jià)
BES
22+
QFN
8000
原裝正品支持實(shí)單
 詢價(jià)
更多BES0330供應(yīng)商 更新時(shí)間2025-4-3 11:06:00

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