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CMR1-04M

SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CMR1-04M

SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CXR1-04

SURFACEMOUNTGENERALPURPOSERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CXR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CXR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04C

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

HS-QSFP-P1-04

FLYOVER?QSFPCABLEASSEMBLIES

SamtecSamtec, Inc

美國(guó)申泰

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
BELLING/上海貝嶺
25+
QFN64
820000
全新原廠原裝正品支持實(shí)單
 詢價(jià)
FISCHERELE
23+
10000
原廠授權(quán)一級(jí)代理,專業(yè)海外優(yōu)勢(shì)訂貨,價(jià)格優(yōu)勢(shì)、品種
 詢價(jià)
BEILING
2016+
SOP16
6528
只做進(jìn)口原裝現(xiàn)貨!假一賠十!
 詢價(jià)
BL
23+
SOP-16
1191
全新原裝現(xiàn)貨
 詢價(jià)
BEILING
24+
SOP16
5000
全現(xiàn)原裝公司現(xiàn)貨
 詢價(jià)
BEILING
23+
SOP16
8650
受權(quán)代理!全新原裝現(xiàn)貨特價(jià)熱賣!
 詢價(jià)
BELING/上海貝嶺
23+
SOP16
50000
全新原裝正品現(xiàn)貨,支持訂貨
 詢價(jià)
BEILING
23+
SOP16
50000
全新原裝正品現(xiàn)貨,支持訂貨
 詢價(jià)
BEILING
04+
SOP16
19950
一級(jí)代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力
 詢價(jià)
BELING/上海貝嶺
2023+
SOP16
19950
一級(jí)代理優(yōu)勢(shì)現(xiàn)貨,全新正品直營(yíng)店
 詢價(jià)
更多BL1-04供應(yīng)商 更新時(shí)間2025-4-24 9:01:00

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