BY229XB-800中文資料威世科技數(shù)據(jù)手冊PDF規(guī)格書

FEATURES

? Glass passivated chip junction

? Superfast recovery time for high efficiency

? Low leakage current

? High forward surge capability

? Meets MSL level 1, per J-STD-020, LF

maximum peak of 245 °C (for TO-263AB package)

? Solder dip 260 °C, 40 s (for TO-220AC and

ITO-220AC package)

? Component in accordance to RoHS 2002/95/EC

and WEEE 2002/96/EC

TYPICAL APPLICATIONS

For use in fast switching rectification of power

supply, inverters, converters and freewheeling diodes

application.

MECHANICAL DATA

Case: TO-220AC, ITO-220AC, TO-263AB

Epoxy meets UL 94V-0 flammability rating

Terminals: Matte tin plated leads, solderable per

J-STD-002 and JESD22-B102

E3 suffix for commercial grade, meets JESD 201 class

1A whiskter test, HE3 suffix for high reliability grade

(AEC Q101 qualified), meets JESD 201 class 2

whisker test

Polarity: As marked

Mounting Torque: 10 in-lbs maximum