CDHV2512AG20M0F0500HEF中文資料威世科技數(shù)據(jù)手冊PDF規(guī)格書

? High voltage up to 3000 V

? Typical resistance ratios of 250:1 to a maximum

resistance ratio of 500:1

? Flow solderable

? Tape and reel packaging available

? Termination style: 3-sided wraparound termination or

single termination flip chip available

? Suitable for solderable, epoxy bondable, or wire bondable

applications

? Termination material: solder-coated nickel barrier or

solder coated non-magnetic terminations standard; gold,

palladium silver, platinum gold, platinum silver or platinum

palladium gold terminations available

? Multiple styles, termination materials and configurations,

allow wide design flexibility

? Epoxy bondable or wire bondable non-magnetic

terminations available