CS3D中文資料威世科技數(shù)據(jù)手冊PDF規(guī)格書

FEATURES

? Low profile package

? Ideal for automated placement

? Glass passivated pellet chip junction

? Low forward voltage drop

? Low leakage current

? High forward surge capability

? Meets MSL level 1, per J-STD-020, LF maximum peak

of 260 °C

? Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS

For use in general purpose rectification of power supplies,

inverters, converters, and freewheeling diodes for

consumer, and telecommunication.

MECHANICAL DATA

Case: SMC (DO-214AB)

Molding compound meets UL 94 V-0 flammability rating

Base P/N-E3 - RoHS-compliant, commercial grade

Terminals: matte tin plated leads, solderable per

J-STD-002 and JESD 22-B102

E3 suffix meets JESD 201 class 2 whisker test

Polarity: color band denotes cathode end