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CY7C1311JV18-300BZI中文資料賽普拉斯數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

CY7C1311JV18-300BZI
廠商型號(hào)

CY7C1311JV18-300BZI

功能描述

18-Mbit QDR II SRAM 4-Word Burst Architecture

文件大小

689.64 Kbytes

頁(yè)面數(shù)量

27 頁(yè)

生產(chǎn)廠商 CypressSemiconductor
企業(yè)簡(jiǎn)稱(chēng)

Cypress賽普拉斯

中文名稱(chēng)

賽普拉斯半導(dǎo)體公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-2-23 23:00:00

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CY7C1311JV18-300BZI規(guī)格書(shū)詳情

Functional Description

The CY7C1311JV18, CY7C1911JV18, CY7C1313JV18, and CY7C1315JV18 are 1.8V Synchronous Pipelined SRAMs, equipped with QDR II architecture. QDR II architecture consists of two separate ports: the read port and the write port to access the memory array. The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to support write operations. QDR II architecture has separate data inputs and data outputs to eliminate the need to ‘turnaround’ the data bus required with common IO devices.

Features

■ Separate Independent Read and Write Data Ports

? Supports concurrent transactions

■ 300 MHz Clock for High Bandwidth

■ 4-word Burst for reducing Address Bus Frequency

■ Double Data Rate (DDR) interfaces on both read and write ports (data transferred at 600 MHz) at 300 MHz

■ Two Input Clocks (K and K) for Precise DDR Timing

? SRAM uses rising edges only

■ Two Input Clocks for Output Data (C and C) to minimize Clock Skew and Flight Time mismatches

■ Echo Clocks (CQ and CQ) simplify Data Capture in High Speed Systems

■ Single Multiplexed Address Input Bus latches Address Inputs for both Read and Write Ports

■ Separate Port Selects for Depth Expansion

■ Synchronous Internally Self-timed Writes

■ QDR? II Operates with 1.5 Cycle Read Latency when the Delay Lock Loop (DLL) is enabled

■ Operates like a QDR I device with 1 Cycle Read Latency in DLL Off Mode

■ Available in x8, x9, x18, and x36 configurations

■ Full Data Coherency, providing most current Data

■ Core VDD = 1.8 (±0.1V); IO VDDQ = 1.4V to VDD

■ Available in 165-Ball FBGA Package (13 x 15 x 1.4 mm)

■ Offered in both Pb-free and non Pb-free packages

■ Variable Drive HSTL Output Buffers

■ JTAG 1149.1 Compatible Test Access Port

■ Delay Lock Loop (DLL) for Accurate Data Placement

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CYPRESS(賽普拉斯)
23+
LBGA165
7350
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BGA
68900
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Infineon Technologies
23+/24+
165-LBGA
8600
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Cypress Semiconductor Corp
23+
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7300
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SPANSION(飛索)
2447
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315000
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CYPRESSS
2022+
BGA
20000
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CYPRESS/賽普拉斯
2308+
BGA
6800
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CYPRESS
2020+
BGA
120
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CYPRESSS
2023+
BGA
80000
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