EF-8000GL中文資料ETC數(shù)據(jù)手冊PDF規(guī)格書
EF-8000GL規(guī)格書詳情
ALPHA EF-8000 GL is a rosin-containing flux designed to provide the attributes of excellent solderability and reliability in general and high-density boards in both Lead-Free and eutectic tin/lead processes. It is designed to have low bridging on bottom side QFP’s with 144-168 leads as well as superior performance in hole-fill and solderballing. Additionally, it provides good lead free solder joint cosmetics with an evenly spread, tack free residue.
Features for Pb-Free
?Good hole-fill demonstrated by >96 yield on 10 mil holes.
?Low bridging performance on connectors.
?Good micro-solder ball performance in Lead-Free applications
?Pin testable
?Specifically designed for use on Cu-OSP PCBs
Benefits:
?Excellent Lead-Free soldering performance on various board finishes.
?Evenly spread, tack free residue.
?Capable for high density as well as general purpose Lead-Free soldering processes.
?Can be used in Pb free or Sn/Pb processes
| 供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
|---|---|---|---|---|---|---|---|
EPCOS |
21+ |
放電管 |
2000 |
原裝現(xiàn)貨假一賠十 |
詢價 | ||
23+ |
2096 |
詢價 | |||||
schrack |
23+ |
NA |
127 |
專做原裝正品,假一罰百! |
詢價 | ||
ST |
24+ |
DIP-16 |
21 |
詢價 | |||
TE/泰科 |
2508+ |
/ |
320680 |
一級代理，原裝現(xiàn)貨 |
詢價 | ||
INTEL |
19+ |
BGA |
256800 |
原廠代理渠道,每一顆芯片都可追溯原廠； |
詢價 | ||
Intel |
25+ |
PBGA-609 |
16000 |
原裝優(yōu)勢絕對有貨 |
詢價 | ||
ST |
23+ |
DIP-24 |
16900 |
正規(guī)渠道,只有原裝! |
詢價 | ||
EPCOS |
ROHS |
13352 |
一級代理 原裝正品假一罰十價格優(yōu)勢長期供貨 |
詢價 | |||
SUNON風機 |
23+ |
10000 |
原廠授權一級代理,專業(yè)海外優(yōu)勢訂貨,價格優(yōu)勢、品種 |
詢價 |
