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F6589

ULTRA THIN MCP ASSEMBLY WITH CENTER HOLE

FEATURES ●UltraThinType:2.5mm(Max.) ?Detectionatcloseddistancefromsamples ●FlexibleLeadOut(polymidefilm) ?Easysystemdesignwithaflexiblewiring ?Lowoutguessingforhighvacuumoperation ●LightWeight APPLICATIONS ●SEM ●FIBSystem ●MaskAligner ●Elec

HAMAMATSUHamamatsu Photonics Co.,Ltd.

濱松光子濱松光子學(xué)株式會(huì)社

BGA6589

MMICwidebandmediumpoweramplifier

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

BGA6589

MMICwidebandmediumpoweramplifier

PhilipsNXP Semiconductors

飛利浦荷蘭皇家飛利浦

BGA6589

RFManual16thedition

Generaldescription 10WplasticLDMOSpowertransistorforbasestationapplicationsatfrequenciesfrom700MHzto2700MHz. Featuresandbenefits ■Highefficiency ■Excellentruggedness ■Designedforbroadbandoperation ■Excellentthermalstability ■Highpowergain ■IntegratedESDp

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

BR6589

RFAMPLIFIERMODEL

APITECH

API Technologies Corp

CEM6589

DualEnhancementModeFieldEffectTransistor(NandPChannel)

60V,4.5A,RDS(ON)=55mW@VGS=10V. FEATURES RDS(ON)=72mW@VGS=4.5V. -60V,-3.1A,RDS(ON)=130mW@VGS=-10V. RDS(ON)=170mW@VGS=-4.5V. SuperhighdensecelldesignforextremelylowRDS(ON). Highpowerandcurrenthandingcapability. SurfacemountPackage. RoHScompliant.

CET-MOSCET-MOS Technology Corp.

華瑞華瑞功率電子股份有限公司

RN6589

RFAMPLIFIERMODEL

APITECH

API Technologies Corp

SGA-6589

DC4000MHZSILICONGERMANIUMHBTCASCADEABLEGAINBLOCK

[Stanford-Microdevices] ProductDescription StanfordMicrodevicesSGA-6589isahighperformancecascadeable50-ohmamplifier.ThisRFICusesthelatestSiliconGermaniumHeterostructureBipolarTransistor(SiGeHBT)processfeaturing1micronemitterswithFTupto50GHz.

ETCList of Unclassifed Manufacturers

未分類制造商

SGA-6589

DC-3500MHz,CascadableSiGeHBTMMICAmplifier

ProductDescription TheSGA-6589isahighperformanceSiGeHBTMMICAmplifier.ADarlingtonconfigurationfeaturing1micronemittersprovideshighFTandexcellentthermalperfomance.Theheterojunctionincreasesbreakdownvoltageandminimizesleakagecurrentbetweenjunctions.Cancellationof

SIRENZA

SIRENZA MICRODEVICES

SGA6589Z

DCto3500MHz,CASCADABLELOWNOISE,HIGHGAINSiGeHBT

RFMD

RF Micro Devices

詳細(xì)參數(shù)

  • 型號(hào):

    F6589

  • 制造商:

    HAMAMATSU

  • 制造商全稱:

    Hamamatsu Corporation

  • 功能描述:

    ULTRA THIN MCP ASSEMBLY WITH CENTER HOLE

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
MAXIM
19+
BGA
256800
原廠代理渠道,每一顆芯片都可追溯原廠;
詢價(jià)
MAXIM/美信
18+
BGA
9315
全新原裝現(xiàn)貨,可出樣品,可開(kāi)增值稅發(fā)票
詢價(jià)
MAXIM/美信
24+
BGA
25500
授權(quán)代理直銷,原廠原裝現(xiàn)貨,假一罰十,特價(jià)銷售
詢價(jià)
MAXIM/美信
2447
BGA
100500
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨
詢價(jià)
MAXIM/美信
24+
BGA
9600
原裝現(xiàn)貨,優(yōu)勢(shì)供應(yīng),支持實(shí)單!
詢價(jià)
MAXIM/美信
23+
BGA
50000
全新原裝正品現(xiàn)貨,支持訂貨
詢價(jià)
MAXIM/美信
22+
BGA
50000
只做原裝假一罰十,歡迎咨詢
詢價(jià)
MAXIM/美信
23+
NA/
3001
優(yōu)勢(shì)代理渠道,原裝正品,可全系列訂貨開(kāi)增值稅票
詢價(jià)
MAXIM/美信
23+
BGA
6500
專注配單,只做原裝進(jìn)口現(xiàn)貨
詢價(jià)
MAXIM/美信
23+
BGA
6500
專注配單,只做原裝進(jìn)口現(xiàn)貨
詢價(jià)
更多F6589供應(yīng)商 更新時(shí)間2025-4-4 16:12:00