FCCSP_V01中文資料amkor數(shù)據(jù)手冊PDF規(guī)格書

APPLICATIONS

The fcCSP package is an attractive option for applications in which both performance and form factor are critical. Examples include high-performance mobile devices (including 5G), infotainment and ADAS for automotive and AI. Further, the benefits from low inductance and increased routing density enable optimized electrical paths for highfrequency signals, making fcCSP suitable for Baseband, RF and in-substrate antenna applications.

Features

Suitable for low and high-frequency applications

Low inductance of flip chip bumps – short, direct signal path

No technological limitation to BGA ball count

Target markets – mobile (AP, BB, RF, PMIC), automotive, consumer, connectivity, multi-die (side-by-side or stacked) applications requiring high-routing density

Custom package sizes and shapes with strip-based processing

Coreless, thin core, laminate and molded substrate construction

Bare die, overmolded, exposed die molded constructions

Accommodates package sizes from 1 x 1 mm2 to 25 x 25 mm2

Bump pitches down to 50 μm in-line and 30/60 μm staggered

BGA ball pitches down to 0.3 mm

Package thicknesses down to 0.35 mm

Turnkey solutions – design, bumping, wafer probe, assembly, final test

Exposed die molding available for low-profile and thermal applications

Heat spreader attach available for high-power devices

Bottom side chip attach available for AiP applications (POSSUM?)

Mass reflow and thermal compression chip attach available