H1AF中文資料RFE國際公司數(shù)據(jù)手冊PDF規(guī)格書
H1AF規(guī)格書詳情
FEATURES
● Low profile package
● Ideal for automated placement
● Glass passivated chip junction
● High forward surge capability
● Super fast reverse recovery time
● Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
