首頁(yè) >HPI1608-2R2M>規(guī)格書列表
| 零件編號(hào) | 下載 訂購(gòu) | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
SurfaceMountPowerInductors | ICE ice Components, Ins. | ICE | ||
SurfaceMountPowerInductors | ICE ice Components, Ins. | ICE | ||
SurfaceMountPowerInductors | ICE ice Components, Ins. | ICE | ||
SurfaceMountPowerInductors | ICE ice Components, Ins. | ICE | ||
POWERINDUCTOR ●FEATURE 1.HighcurrentcapacityandLowDCR(usedceramicbase) 2.Highheatresistance,idealforreflowsoldering 3.Openmagneticcircuitconstruction ●APPLICATION 1.DC-DCconverter,PDAandCellularPhone 2.Settopbox,NotebookandServer | AITSEMIAiT Semiconductor Inc. 創(chuàng)瑞科技AiT創(chuàng)瑞科技 | AITSEMI | ||
SMDPowerInductor | BournsBourns Electronic Solutions 伯恩斯 | Bourns | ||
SMDPowerInductorsUnshielded | PREMOPREMO CORPORATION S.L 普萊默 | PREMO | ||
SMDPOWERINDUCTOR-RoHS | FENGJUIFENGJUI TECHNOLOGY CO., LTD. 峰瑞科技峰瑞科技有限公司 | FENGJUI | ||
SMDPOWERINDUCTOR-RoHS | FENGJUIFENGJUI TECHNOLOGY CO., LTD. 峰瑞科技峰瑞科技有限公司 | FENGJUI | ||
SMDPowerInductorsShielded | PREMOPREMO CORPORATION S.L 普萊默 | PREMO |
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
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