HT1MOA3S30SLASHESLASH1中文資料飛利浦?jǐn)?shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

Definitions

Objective of the Specifications

This specification lists the parameters to be fulfilled by the HITAG 1 chip module HT1 MOA3 S30 for contactless smart cards or similar transponders (as e.g. discs).

Definition of the Chip Module

A chip module is an electronically packaged chip covered with a globe top cap. The HT1 MOA3 S30 is above all used as card module, i.e. for further lamination into contactless smart cards according to ISO 10536.1.

So the HITAG 1 chip module HT1 MOA3 S30 is best suited for customers that do not want to spend time with micro assembly and therefore start - e.g. ISO card production - with the HITAG 1 chip module.

Use of the Modules

The HITAG 1 modules are designed to be connected to a coil and then to be further processed by packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing information for the coil-module connection and packaging is given in the specification.

For production of contactless chip cards it is recommended to prepunch card foils to create a recess for the chip module in the card body.