IRLL110_V01中文資料威世科技數(shù)據(jù)手冊(cè)PDF規(guī)格書

FEATURES

? Surface-mount

? Available in tape and reel

? Dynamic dV/dt rating

? Logic-level gate drive

? RDS(on) specified at VGS = 4 V and 5 V

? Fast switching

? Ease of paralleling

? Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

DESCRIPTION

Third generation power MOSFETs from Vishay provide the

designer with the best combination of fast switching,

ruggedized device design, low on-resistance and

cost-effectiveness.

The SOT-223 package is designed for surface-mounting

using vapor phase, infrared, or wave soldering techniques.

Its unique package design allows for easy automatic

pick-and-place as with other SOT or SOIC packages but

has the added advantage of improved thermal performance

due to an enlarged tab for heatsinking. Power dissipation of

greater than 1.25 W is possible in a typical surface mount

application.