LQFP中文資料amkor數(shù)據(jù)手冊(cè)PDF規(guī)格書

Low Profile Quad Flat Pack (LQFP) Packages:

Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers

to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability.

Features:

Amkor’s LQFP packaging portfolio provides:

? 7 x 7 mm to 28 x 28 mm body size

? 32 to 256 lead counts

? Copper leadframes ? Broad selection of die pad sizes

? Custom leadframe design available

? 1.4 mm body thickness

? Low stress die attach adhesive

? Rapid cure mold compound

? Power enhancement version - PowerQuad

Applications:

Amkor’s LQFPs are an ideal IC package for most IC semiconductor technologies such as ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets.