MO-216中文資料amkor數(shù)據(jù)手冊PDF規(guī)格書
| 廠商型號 |
MO-216 |
| 功能描述 | The FlipStack? CSP family utilizes Amkor’s industry leading ChipArray? Ball Grid Array (CABGA) manufacturing capabilities |
| 文件大小 |
728.44 Kbytes |
| 頁面數(shù)量 |
2 頁 |
| 生產(chǎn)廠商 | Amkor Technology |
| 企業(yè)簡稱 |
amkor |
| 中文名稱 | Amkor Technology官網(wǎng) |
| 原廠標(biāo)識 |  |
| 數(shù)據(jù)手冊 | |
| 更新時間 | 2025-5-21 23:00:00 |
| 人工找貨 | MO-216價格和庫存，歡迎聯(lián)系客服免費人工找貨 |
MO-216規(guī)格書詳情
FEATURES
Package height down to 0.6 mm
Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices
Established package infrastructure with standard CABGA and fcCSP footprints
Consistent product performance with high yields and reliability
Die overhang wirebonding
Low loop wirebonding to 40 μm or less
Pb-free, RoHS compliant and green materials
Passive component integration options
JEDEC standard outlines including MO-192, MO-195, MO-216, MO-219 and MO-298
Applications
FlipStack? CSP technology enables smaller, lighter and more innovative new product form factors at a lower cost. This solution address es a range of design requirements, and enables a wide variety of applications, including portable multimedia devices such as tablets, cell phones and digital cameras.
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
|---|---|---|---|---|---|---|---|
ST/意法 |
24+ |
NA/ |
33250 |
原裝現(xiàn)貨,當(dāng)天可交貨,原型號開票 |
詢價 | ||
ST |
24+ |
SOP-8 |
80000 |
只做自己庫存,全新原裝進(jìn)口正品假一賠百,可開13%增 |
詢價 | ||
ST |
07+ |
SOP-8 |
30000 |
一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力 |
詢價 | ||
ST/意法 |
25+ |
SOIC |
65428 |
百分百原裝現(xiàn)貨 實單必成 |
詢價 | ||
IMP |
23+ |
S |
13000 |
原廠授權(quán)一級代理,專業(yè)海外優(yōu)勢訂貨,價格優(yōu)勢、品種 |
詢價 | ||
ST |
25+23+ |
SOIC3.9mm |
8295 |
絕對原裝正品全新進(jìn)口深圳現(xiàn)貨 |
詢價 | ||
ST |
2016+ |
SOIC/3.9mm |
6528 |
只做原廠原裝現(xiàn)貨!終端客戶個別型號可以免費送樣品! |
詢價 | ||
24+ |
QFP |
2700 |
全新原裝自家現(xiàn)貨優(yōu)勢! |
詢價 | |||
ST |
24+ |
SOP |
2560 |
絕對原裝!現(xiàn)貨熱賣! |
詢價 | ||
ST |
0005+ |
SOIC/3.9mm |
398 |
原裝現(xiàn)貨海量庫存歡迎咨詢 |
詢價 |
