PBGA中文資料amkor數(shù)據(jù)手冊PDF規(guī)格書
PBGA規(guī)格書詳情
KEY FEATURES
Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage
Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures
產(chǎn)品屬性
- 型號：
PBGA
- 制造商：
AMKOR
- 制造商全稱：
AMKOR
- 功能描述：
Innovative designs and expanding package offerings provide a platform from prototype-to-production
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
|---|---|---|---|---|---|---|---|
PRACTICAL |
2016+ |
BGA |
5500 |
只做原裝,假一罰十,公司可開17%增值稅發(fā)票! |
詢價 | ||
PRACTUAL |
23+ |
BGA |
20000 |
全新原裝假一賠十 |
詢價 | ||
PRACTUAL |
BGA |
2890 |
全新原裝進口自己庫存優(yōu)勢 |
詢價 | |||
ASE |
20+ |
BGA |
35830 |
原裝優(yōu)勢主營型號-可開原型號增稅票 |
詢價 | ||
Infineon |
24+ |
BGA |
2978 |
100%全新原裝公司現(xiàn)貨供應(yīng)!隨時可發(fā)貨 |
詢價 | ||
Infineon |
22+ |
BGA27 |
3000 |
原裝現(xiàn)貨 |
詢價 | ||
AMKOR |
23+ |
原廠原包 |
19960 |
只做進口原裝 終端工廠免費送樣 |
詢價 | ||
Infineon |
24+ |
BGA |
16800 |
絕對原裝進口現(xiàn)貨,假一賠十,價格優(yōu)勢!? |
詢價 | ||
TOPLINE |
2023+ |
BGA |
50000 |
原裝現(xiàn)貨 |
詢價 | ||
TOSHIBA |
22+ |
BGA |
3000 |
原裝正品,支持實單 |
詢價 |
