TEPBGA-3中文資料amkor數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

Features

Innovative designs and expanding package offerings provide a platform from prototype-to-production.

Custom ball counts up to 1521

1.00, 1.27 & 1.50 mm standard ball pitch available (other ball pitches available upon request, e.g. 0.8 mm)

17 to 40 mm body sizes

Thin Au wire or Cu wire compatible

Chip-on-Chip (CoC)

Large mold cap for quality enhancement

Low profile and lightweight

Thermal and electrical enhancement capable

Highly flexible internal routing of signal, power and ground for device performance and system compatibility

HDI designs possible

Suitable substrate for multi-die (MCM) and integrated SMT structures

Mature strip based manufacturing process with high yields

Full in-house design capability

Quickest design-to-prototype delivery

Perimeter, stagger and full ball arrays

Special packaging for memory available

Multi-layer, ground/power

JEDEC MS-034 standard outlines

Excellent reliability

63 Sn/37 Pb eutectic or Pb-free solder balls

Applications

The integrated design features of Amkor’s PBGAs offer enhanced performance in many devices, making this the ideal package for: microprocessors, microcontrollers, ASICs, gate arrays, memory, DSPs, PLDs, graphics and PC chip sets.

Applications requiring improved portability, form-factor/size and high-performance such as cellular, wireless telecommunications, PCMCIA cards, Global Positioning Systems (GPS), laptop PCs, netbooks, video cameras, disc drives and similar products benefit from Amkor’s PBGA attributes.