UG12XT_V01中文資料威世科技數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

FEATURES

? Power pack

? Glass passivated pellet chip junction

? Ultrafast recovery time

? Soft recovery characteristics

? Low switching losses, high efficiency

? High forward surge capability

? Meets MSL level 1, per J-STD-020, LF maximum peak of

245 °C (for TO-263AB package)

? Solder dip 275 °C max., 10 s per JESD 22-B106

(for TO-220AC and ITO-220AC package)

? AEC-Q101 qualified

? Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS

For use in high voltage and high frequency power factor

correction, freewheeling diodes and secondary DC/DC

rectification application.

MECHANICAL DATA

Case: TO-220AC, ITO-220AC, TO-263AB?

Molding compound meets UL 94V-0 flammability rating

Base P/N-E3 - RoHS-compliant, commercial grade

Base P/NHE3 - RoHS-compliant, AEC-Q101 qualified

Terminals: Matte tin plated leads, solderable per

J-STD-002 and JESD22-B102?

E3 suffix meets JESD 201 class 1A whisker test, HE3 suffix

meets JESD 201 class 2 whisker test

Polarity: As marked

Mounting Torque: 10 in-lbs max.