VLMV3100_V02中文資料威世科技數(shù)據(jù)手冊(cè)PDF規(guī)格書

DESCRIPTION

These devices have been designed to meet the increasing

demand for surface mounting technology.

The package of the VLMV3100 is the PLCC-3.

It consists of a lead frame which is embedded in a white

thermoplast. The reflector inside this package is filled up

with clear epoxy.

This SMD device consists of a red and green chip. So it is

possible to choose the color in one device

FEATURES

? SMD LED with exceptional brightness

? Dualcolor

? Luminous intensity categorized

? Compatible with automatic placement equipment

? EIA and ICE standard package

? Compatible with IR reflow, vapor phase and wave

soldering processes according to CECC 00802

and J-STD-020

? Available in 8 mm tape

? Low profile package

? Non-diffused lens: Excellent for coupling to light pipes

and backlighting

? Low power consumption

? Luminous intensity ratio in one packaging unit

IVmax./IVmin. ≤ 1.6

? Preconditioning according to JEDEC? level 2a

? ESD-withstand voltage: Up to 2 kV according to

JESD22-A114-B

? Material categorization: for definitions o