VLRYG31P1Q2-GS08中文資料威世科技數(shù)據(jù)手冊(cè)PDF規(guī)格書

DESCRIPTION

This device has been designed to meet the increasing

demand for AlInGaP technology.

It consists of a lead frame which is embedded in a white

thermoplast. The reflector inside this package is filled up

with clear epoxy.

LED is mounted top down and emits through the PCB.

FEATURES

? SMD LED with exceptional brightness

? Luminous intensity categorized

? Compatible with automatic placement

equipment

? EIA and ICE standard package

? Compatible with IR reflow, vapor phase

and wave solder processes according to

CECC 00802 and J-STD-020C

? Available in 12 mm tape

? Low profile package

? Non-diffused lens: Excellent for coupling to light pipes and

backlighting

? Low power consumption

? Luminous intensity ratio in one packaging unit

IVmax./IVmin. > 1.6

? Preconditioning according to JEDEC? level 2

? ESD-withstand voltage: up to 2 kV according to

JESD22-A114-B

? Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912