M74HC166B1R集成電路（IC）的移位寄存器規(guī)格書PDF中文資料

M74HC166B1R屬于集成電路（IC）的移位寄存器。由意法半導(dǎo)體集團(tuán)制造生產(chǎn)的M74HC166B1R移位寄存器移位寄存器是低級邏輯器件，通常用于在串行和并行方式之間轉(zhuǎn)換數(shù)字邏輯信號形式的數(shù)據(jù)，或在數(shù)字字內(nèi)移動(dòng)數(shù)據(jù)位的位置。移位寄存器通常使用集成到一個(gè)設(shè)備中的一組觸發(fā)器來實(shí)現(xiàn)，常用于集成度更高的邏輯器件，但仍可用于 I/O 擴(kuò)展等應(yīng)用，在這些應(yīng)用中離散形式的函數(shù)可能會(huì)非常有用。

Description

The M54HCxxx and M54HCTxxx series are composed of over 90 types of high speed CMOS functions specifically designed to meet the radiation requirements of the aerospace industry. It includes a large set of gates, Flip-Flops, Multiplexers, Counters, Bus interface and several other functions. The radiation hardness, the single event latch-up (SEL) immunity and the housing in hermetic packages of all types of both series make them ideally suited for use in the most difficult environmental conditions.

Features

■ 2 to 6 V operating voltage

■ Low power DC dissipation: 1 μA max at 25°C

■ High speed tPD = 8 ns typ at 25°C

■ Symmetrical outputs characteristics

■ High noise immunity: 28 of min VCC

■ Hermetic packages

■ Rad-hard 50 krad (Si)

■ SEL immune up to 110 MeV/mg/cm2

■ ESCC qualified

■ Same die and electrical specification for engineering and flight models

■ The complete specification of each type is available from the ESCC web site: https://escies.org using its ESCC part number.

ST guarantees full compliance of qualified parts with these ESCC specifications